The Astonishing Secrets of the Intel 386 Chip's Packaging

A 3D CT scan of the Intel 386 processor reveals a surprisingly complex six-layer wiring structure hidden within its seemingly simple ceramic package. The chip boasts separate power and ground networks for I/O and CPU logic, along with side contacts for electroplating. The analysis also uncovers 'No Connect' pins used for testing, and a hierarchical interface design scaling from microscopic circuitry to macroscopic pins. The article details the 386's packaging technology and Intel's evolution in processor packaging.