Google's Datacenter-Scale Liquid Cooling: A Revolution for AI

The rise of AI has created a significant heat challenge for datacenters. At Hot Chips 2025, Google showcased its massive liquid cooling system designed for its TPUs. This system uses CDUs (Coolant Distribution Units) for rack-level cooling, significantly reducing power consumption compared to air cooling and ensuring system stability through redundancy. Google also employs a bare-die design, similar to PC enthusiast 'de-lidding', to improve the heat transfer efficiency of its TPUv4. This solution not only tackles the immense cooling demands of AI but also points towards a new direction for future datacenter cooling solutions.