Hot Chips 2025: Liquid Cooling Innovations for the AI Boom

Hot Chips 2025 showcased advanced liquid cooling technologies tailored for AI chips. Vendors displayed various microjet-based cold plates capable of precisely cooling chip hotspots, even directly injecting water onto the die. While currently focused on server applications, the precise temperature control offers potential benefits for consumer hardware in the future. The exhibition also featured cold plates in different materials, such as lightweight aluminum and highly efficient copper, catering to varying server weight and cooling needs. Facing the ever-increasing power draw and heat dissipation of AI chips, these liquid cooling innovations are becoming crucial solutions for datacenter cooling.