Intel Xeon 7: Can 18A and 3D Packaging Turn the Tide?

With AMD holding over 40% revenue and 27% shipment share of the x86 server CPU market in the first half of 2025, Intel is betting on its Xeon 7 processors (Clearwater Rapids and Clearwater Forest), launching in 2026, to regain ground. These CPUs leverage the 18A process, 2.5D EMIB interconnect, and Foveros 3D stacking—technologies first deployed (with delays) in the datacenter with the ill-fated Ponte Vecchio. The success of Xeon 7 hinges on stemming AMD's momentum and countering the rise of hyperscaler's custom Arm server CPUs. While the energy-efficient E-core variants have a niche market, they aid Intel in refining its 18A process and 3D packaging. This article details the architecture of the Clearwater Forest E-core processor, including its improved RibbonFET transistors, PowerVia backside power delivery, and 3D packaging, and analyzes its performance potential.
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