Ryzen 7 9800X3D Teardown Reveals Mostly Dummy Silicon

A teardown of AMD's Ryzen 7 9800X3D processor reveals a surprising finding: the majority of its volume is comprised of dummy silicon for structural integrity. While the SRAM cache die is significantly smaller than the compute die, AMD has added a substantial layer of dummy silicon above and below to protect the thin, fragile components. This results in a total package thickness of roughly 800µm, with dummy silicon accounting for a staggering 93%. Despite the seemingly wasteful design, it ensures stability and thermal performance. AMD is expected to announce 12-core and 16-core Ryzen 9 X3D processors soon.