TSMC's 2nm Node: Density King, But High Price May Be a Problem

TSMC unveiled its 2nm platform technology at IEDM 2024, featuring energy-efficient nanosheet transistors and 3DIC co-optimization. The process boasts a 30% power improvement and 15% performance gain over its 3nm node, and is projected to be the densest in the 2nm class. However, analysis suggests that while early yield is impressive, a reported $30,000 per wafer price could hamper competitiveness, potentially opening the door for Intel and Samsung to gain market share. TSMC's 2nm node is expected to enter production in the second half of this year.