TDK Ventures Invests in Silicon Box: Betting on Advanced Chiplet Packaging

This article details why TDK Ventures invested in Silicon Box. Silicon Box is developing advanced chiplet packaging technology, combining multiple small chips (chiplets) into a complete system-on-chip (SoC). This approach overcomes limitations of traditional monolithic chip architectures, improving design flexibility, cost-effectiveness, and performance. Silicon Box's innovation lies in its industry-leading interconnect technology and novel panel packaging, achieving up to 8x higher production efficiency than existing technologies. TDK Ventures' investment is based on Silicon Box's innovation in chiplet interconnect, robust production capabilities, technical expertise, and strong investor partnerships.