IBM Breakthrough: Beyond Copper Interconnects for Future CMOS Nodes
IBM researchers presented two papers at the 2024 IEDM conference on back-end-of-line (BEOL) interconnect technology, showcasing advancements in advanced interconnect solutions. The first paper explored improvements and future directions for copper interconnect technology, while the second (co-authored with Samsung) introduced a post-copper alternative utilizing an advanced low-k dielectric (ALK) material and rhodium (Rh). This new technology significantly enhances performance and reliability, reducing resistance and capacitance, and addressing reliability challenges faced by traditional copper interconnects at 24nm and below. This research paves the way for future CMOS node chip manufacturing and provides crucial support for the continued development of high-performance, low-power logic integrated circuits.
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