Testing for Thermal Issues in Advanced Packages Becomes Increasingly Challenging
The increasing complexity and heterogeneity of chip architectures, coupled with the adoption of high-performance materials, are making it significantly more difficult to identify and test for thermal issues in advanced packages. Traditional corner-based thermal testing is insufficient due to unpredictable chip-level thermal effects and varying heat distribution under different workloads. Heterogeneous integration, thinner substrates and metal layers, and diverse materials and interconnect schemes all contribute to this complexity. To address these challenges, the industry is exploring advanced thermal modeling, test structures, adaptive testing strategies, and AI to achieve more accurate thermal characterization and reliable device testing.
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