TSMC Bets on MicroLED Optical Interconnects for AI Data Centers
In the race to build all-optical AI data centers, TSMC is partnering with Avicena to leverage microLED-based interconnects. This innovative approach replaces traditional copper wires with a cost-effective, energy-efficient optical solution to address the exploding bandwidth demands of AI clusters. Avicena's LightBundle platform uses hundreds of blue microLEDs and imaging fibers, bypassing the complexity and high power consumption of laser-based solutions. By utilizing mature LED, camera, and display technologies, this approach promises higher reliability and scalability, potentially overcoming the bottlenecks in AI data center optical interconnects and enabling faster, lower-latency data transfer for demanding applications like large language models.