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台积电探索全新芯片封装方法以应对AI热潮

2024-06-21
台积电探索全新芯片封装方法以应对AI热潮

全球最大芯片制造商台积电正在探索一种先进的芯片封装新方法,以应对人工智能对算力的需求。台积电正与设备和材料供应商合作开发这种新方法,但商业化可能需要数年时间。

(asia.nikkei.com)
67
未分类 芯片封装

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